Scientists find a way to make ultra-thin diamond films from graphene without high pressure

Foreign media reports that although graphene is only one atom thick, its strength must be heard by everyone, but how can there be any way to make it stronger? -Turn it into pieces of diamond. Researchers in South Korea have now developed a method that can convert graphene into the thinnest diamond film without using high pressure.

Graphene, graphite and diamond are all made of the same material-carbon-but the difference between these materials is the arrangement and combination of carbon atoms. Graphene is a layer of carbon that is only one atom thick, and there is a strong horizontal bond between them. Graphite is composed of graphene sheets stacked layer by layer, each layer has strong bonds inside, and different layers are connected by weak bonds. In diamond, carbon atoms are closely connected in three-dimensional space to form an incredibly hard material.

When the bond between the graphene layers is strengthened, it becomes a 2D form of diamond, called diamane. The problem is that this is usually the case. One method requires extremely high pressure, and once the pressure disappears, the material is reduced to graphene. Other studies need to add hydrogen atoms to graphene, but this will make it difficult to control the bonds.

In this new study, researchers at the Institute of Basic Sciences (IBS) and Ulsan National Institute of Science and Technology (UNIST) replaced hydrogen with fluorine. Their idea was to expose the two layers of graphene to fluorine atoms, and in this way, the two layers of graphene were tightly bonded together to form stronger chemical bonds.

The team first used a reliable method of chemical vapor deposition (CVD) to prepare double-layer graphene on copper and nickel substrates. They then exposed graphene to the steam of xenon difluoride. At this time, the fluorine atoms in the mixture will adhere to the carbon atoms, thereby strengthening the bonding between the graphene layers and forming a layer of ultra-thin fluorinated diamond, F-diamane.

The new process is much simpler than other processes in the past, which should make it relatively easy to expand. Ultra-thin diamond can be used to make stronger, smaller, and more flexible electronic components, especially as wide-gap semiconductors.

The lead author of the study, Pavel V. Bakharev, pointed out that this simple fluorination method can work at near room temperature and low pressure without the use of plasma or any gas activation mechanism, so this greatly reduces the possibility of defects.

Related research reports have been published in "Nature Nanotechnology".

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